4Inch Customized A Axis Sapphire Wafers For Epitaxial Growth 430um SSP DSP

product-sapphire-wafers

• High Light: A axis sapphire wafers,  4 inch sapphire wafers, A axis polished sapphire wafers
• Material: Sapphire Single Crystal
• Orientation: A AXIS
• Surface: Ssp Or Dsp
• Thickness: 0.43mm Or Customized
• Application: Led Epitaxial
• GrowthMethod: Ky
• Ra: <0.3nm
• TTV: 10um
• Bow； -15um~0
• Warp： <15um
• OF Length： 16±1mm At C-axis
• Place of Origin： china
• Brand Name： xinkehui
• Model Number: 2-6INCH
• Minimum Order Quantity: 25pcs
• Price: by case
• Packaging Details: in 25pcs cassette wafer box under 100grade cleaning room
• Delivery Time: 1-4weeks
• Payment Terms: T/T, Western Union, MoneyGram
• Supply Ability: 1000pcs per month

2inch /3inch 4inch /5inch/6inch  C-axis/a axis/  r axis/ m-axis 6″/6inch dia150mm C-plane Sapphire SSP/DSP wafers with 650um/1000um Thickness2inch 4inch customized A axis sapphire wafers for epitaxial growth 430um SSP DSP

About synthetic sapphire crystal

Due to the less mismatched lattice and stable chemical and physical properties, sapphire(Al2O3) wafer is the popular substrates for III-V nitrides, superconductor and magnetic epi-film. They are widely used in GaN and thin-film epitaxial growth, silicon on sapphire, LED market and optics industry.

xinkehui is a professional sapphire wafer supplier who manufactures 99.999% high purity single crystal polished sapphire wafers for epitaxy. And our sapphire (Al2O3) substrates feature excellent surface finish, which is the key LED parameter.

If you are looking for reliable sapphire wafer suppliers, Please feel free to contact us .

Sapphire Properties for A-PLANE (11-20) SAPPHIRE WAFERS

A plane(11-20) sapphire wafers have a uniform dielectric constant and highly insulating characteristic, so they are generally used for hybrid microelectronic applications. This orientation can also be used for the growth of high superconductors.

For example, TlBaCaCuO (TbBaCaCuO), Tl-2212, the hetero-epitaxial superconducting thin film is grown on a sapphire cerium oxide (CeO2) composite substrate. The availability of Angstrom level surface finishes allows for fine line interconnects of hybrid modules.